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Infineon AIMZA75R040M2H is a Silicon Carbide (SiC) FET rated at 750V, 40A, 0.05Ω Rdson(max) in PG-TO247-4



Device Parameter Value feedback*
Manufacturer Name Infineon
Manufacturer Package PG-TO247-4
(Through Hole, 3 Pins,
Thermalpad: Bottom
WxL: 15.94 x 20.95mm2)
Configuration Single
Channel N-Type
Material Silicon Carbide (SiC)
BVDSS [V] 750
RDS(ON) typ, max [Ω] 0.052, na
At VGS = 15V, TA = 25°C
ID max [A] 40
PD max [W] 142
QGS typ, max [nC] 7.7, na
QGD typ, max [nC] 6.4, na
QG Total typ, max [nC] 30, na
RthJA max [C/W] na
RthJC max [C/W] 1.05
DiscoverEE Calculated Values
ID [A] Calc. @RthJA max
TJ=175°C, TA=25°C
na
ID [A] Calc. @ System RthJA = °C/W, TJ=°C, TA=25°C 11.0 (realistic)
Approx. value as we assume RDS(on)max @ 175 °C = 2.5x RDS(on)max @ 25 °C
ID [A] Calc. @RthJC max
TJ=175°C, TC=25°C
33.8 (ideal heatsink, Silicon Carbide (SiC) limit)
Approx. value as we assume RDS(on)max @ 175 °C = 2.5x RDS(on)max @ 25 °C
PD [W] Calc. @RthJA max
TJ=175°C, TA=25°C
na
PD [W] Calc. @ System RthJA = 10 °C/W, TJ=175°C, TA=25°C na
PD [W] Calc. @RthJC max
TJ=175°C, TC=25°C
142.9 (ideal heatsink)

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BVDSS [V] Package RDS(ON) max [Ω] VTH [V] ID [A] PD [W] QG Total [nC] QGS [nC] QGD [nC]
750 Through Hole
WxL: 15.80 x 21.00mm2
# of Pins: 4
Thermalpad: Bottom
0.036 3.5, 5.6 60 234 49 14 12
750 Through Hole
WxL: 15.80 x 21.00mm2
# of Pins: 4
Thermalpad: Bottom
0.04 2, 3.6 80 283 90 38 10.8
750 Through Hole
WxL: 15.80 x 21.00mm2
# of Pins: 4
Thermalpad: Bottom
0.0413 3.5, 5.6 47 164 37 9.4 7.9
750 Through Hole
WxL: 15.80 x 21.00mm2
# of Pins: 3
Thermalpad: Bottom
0.042 1.8, 3.5 55 192 81 27 20
750 Through Hole
WxL: 16.00 x 21.00mm2
# of Pins: 3
Thermalpad: Bottom
0.047 2.8, 4.8 42 136 72 16 25
750 Through Hole
WxL: 15.80 x 21.00mm2
# of Pins: 4
Thermalpad: Bottom
0.052 2, 3.6 69 278 69 29 8.9
750 Through Hole
WxL: 15.80 x 21.00mm2
# of Pins: 4
Thermalpad: Bottom
0.052 3.5, 5.6 44 185 34 9.1 8.6
750 Through Hole
WxL: 16.00 x 21.00mm2
# of Pins: 3
Thermalpad: Bottom
0.059 2.8, 4.8 34 115 63 14 19
750 Through Hole
WxL: 15.80 x 21.00mm2
# of Pins: 4
Thermalpad: Bottom
0.065 3.5, 5.6 32 122 24 6.2 5.1
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