| Device Parameter | Value feedback* | |
| Manufacturer Name | Infineon | |
| Manufacturer Package | PG-HSOF-8 (Surface Mount, 8 Pins, Thermalpad: Bottom WxL: 9.80 x 11.68mm2) |
|
| Configuration | Single | |
| Channel | N-Type | |
| Material | Silicon Carbide (SiC) | |
| BVDSS [V] | 650 | |
| RDS(ON) typ, max [Ω] | 0.013, na At VGS = 15V, TA = 25°C |
|
| ID max [A] | 168 | |
| PD max [W] | 681 | |
| QGS typ, max [nC] | 29, na | |
| QGD typ, max [nC] | 21, na | |
| QG Total typ, max [nC] | 113, na | |
| RthJA max [C/W] | na | |
| RthJC max [C/W] | 0.22 | |
| DiscoverEE Calculated Values | ||
| ID [A] Calc. @RthJA max TJ=175°C, TA=25°C |
na |
|
| ID [A] Calc. @ System RthJA = °C/W, TJ=°C, TA=25°C | 21.4 (realistic) Approx. value as we assume RDS(on)max @ 175 °C = 2.5x RDS(on)max @ 25 °C
|
|
| ID [A] Calc. @RthJC max TJ=175°C, TC=25°C |
144.3 (ideal heatsink, Silicon Carbide (SiC) limit) Approx. value as we assume RDS(on)max @ 175 °C = 2.5x RDS(on)max @ 25 °C |
|
| PD [W] Calc. @RthJA max TJ=175°C, TA=25°C |
na | |
| PD [W] Calc. @ System RthJA = 10 °C/W, TJ=175°C, TA=25°C | na | |
| PD [W] Calc. @RthJC max TJ=175°C, TC=25°C |
681.8 (ideal heatsink) | |
| BVDSS [V] | Package | RDS(ON) max [Ω] | VTH [V] | ID [A] | PD [W] | QG Total [nC] | QGS [nC] | QGD [nC] |
| 650 | Surface Mount WxL: 9.90 x 11.73mm2 # of Pins: 8 Thermalpad: Bottom |
0.012 | 1.9, 3.5 | 173 | 395 | 256 | 100 | 28 |
| 600 | Surface Mount WxL: 9.80 x 11.68mm2 # of Pins: 8 Thermalpad: Bottom |
0.016 | 3.7, 4.7 | 142 | 694 | 171 | 45 | 61 |