Infineon IMWH170R1K0M1 is a Silicon Carbide (SiC) FET rated at 1700V, 5.4A, 0.88Ω Rdson(max) in PG-TO247-3

Datasheet

Device Parameter	Value feedback*
Manufacturer Name	Infineon
Manufacturer Package	PG-TO247-3 (Through Hole, 3 Pins, Thermalpad: Bottom WxL: 15.94 x 20.95mm²)
Configuration	Single
Channel	N-Type
Material	Silicon Carbide (SiC)
BVDSS [V]	1700
RDS(ON) typ, max [Ω]	1, na At VGS = 12V, TA = 25°C
ID max [A]	5.4
PD max [W]	70
QGS typ, max [nC]	2, na
QGD typ, max [nC]	1.4, na
QG Total typ, max [nC]	5.5, na
RthJA max [C/W]	62
RthJC max [C/W]	2.13
DiscoverEE Calculated Values
ID [A] Calc. @RthJA max TJ=175°C, TA=25°C	1.0 (conservative) Approx. value as we assume RDS(on)max @ 175 °C = 2.5x RDS(on)max @ 25 °C
ID [A] Calc. @ System RthJA = °C/W, TJ=°C, TA=25°C	2.6 (realistic) Approx. value as we assume RDS(on)max @ 175 °C = 2.5x RDS(on)max @ 25 °C
ID [A] Calc. @RthJC max TJ=175°C, TC=25°C	5.7 (ideal heatsink, Silicon Carbide (SiC) limit) Approx. value as we assume RDS(on)max @ 175 °C = 2.5x RDS(on)max @ 25 °C
PD [W] Calc. @RthJA max TJ=175°C, TA=25°C	2.4 (conservative)
PD [W] Calc. @ System RthJA = 10 °C/W, TJ=175°C, TA=25°C	15.0 (realistic)
PD [W] Calc. @RthJC max TJ=175°C, TC=25°C	70.4 (ideal heatsink)

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BV_DSS [V]	Package	R_DS(ON) max [Ω]	V_TH [V]	I_D [A]	P_D [W]	Q_{G Total} [nC]	Q_GS [nC]	Q_GD [nC]
1700	Through Hole WxL: 15.94 x 20.95mm² # of Pins: 3 Thermalpad: Bottom	0.58	3.5, 5.7	7.5	88	8.1	2.9	1.8
1700	Through Hole WxL: 15.94 x 20.95mm² # of Pins: 3 Thermalpad: Bottom	0.63	1.8	7	70	13	3	4
1700	Through Hole WxL: 15.94 x 20.95mm² # of Pins: 3 Thermalpad: Bottom	0.63	1.8	7	70	13	3	4
1700	Through Hole WxL: 15.80 x 20.95mm² # of Pins: 3 Thermalpad: Bottom	0.8	2, 4	5	55	23	3.2	12.5
1700	Through Hole WxL: 15.80 x 20.95mm² # of Pins: 3 Thermalpad: Bottom	0.8	2, 4	5	55	23	3.2	12.5
1700	Through Hole WxL: 15.95 x 21.00mm² # of Pins: 3 Thermalpad: Bottom	0.85	2, 4	7	62	23	5.4	7.6
1700	Through Hole WxL: 16.01 x 21.13mm² # of Pins: 3 Thermalpad: Bottom	1	1.8, 4	6.2	60	13	3.5	6
1700	Through Hole WxL: 15.60 x 20.45mm² # of Pins: 3 Thermalpad: Bottom	1	2.3, 4.2	7	79	12	3.8	5
1700	Through Hole WxL: 15.95 x 21.00mm² # of Pins: 3 Thermalpad: Bottom	1		8.4	79	19.8	3	12
1700	Through Hole WxL: 15.94 x 22.54mm² # of Pins: 4 Thermalpad: Bottom	1.05	2, 4	5.2		14	2.4	9.3

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