Device Parameter | Value feedback* | |
Manufacturer Name | Infineon | |
Manufacturer Package | PG-HSOF-8 (Surface Mount, 8 Pins, Thermalpad: Bottom WxL: 9.80 x 11.68mm2) |
|
Configuration | Single | |
Channel | N-Type | |
Material | Silicon | |
BVDSS [V] | 200 | |
RDS(ON) typ, max [Ω] | 0.0057, 0.0067 At VGS = 10V, TA = 25°C |
|
ID max [A] | 137 | |
PD max [W] | 300 | |
QGS typ, max [nC] | 37, na | |
QGD typ, max [nC] | 14, 21 | |
QG Total typ, max [nC] | 71, 107 | |
RthJA max [C/W] | 40 | |
RthJC max [C/W] | 0.5 | |
DiscoverEE Calculated Values | ||
ID [A] Calc. @RthJA max TJ=175°C, TA=25°C |
15.6 (conservative) Approx. value as we assume RDS(on)max @ 175 °C = 2.5x RDS(on)max @ 25 °C |
|
ID [A] Calc. @ System RthJA = °C/W, TJ=°C, TA=25°C | 31.1 (realistic) Approx. value as we assume RDS(on)max @ 175 °C = 2.5x RDS(on)max @ 25 °C
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ID [A] Calc. @RthJC max TJ=175°C, TC=25°C |
139.1 (ideal heatsink, Silicon limit) Approx. value as we assume RDS(on)max @ 175 °C = 2.5x RDS(on)max @ 25 °C |
|
PD [W] Calc. @RthJA max TJ=175°C, TA=25°C |
3.8 (conservative) | |
PD [W] Calc. @ System RthJA = 10 °C/W, TJ=175°C, TA=25°C | 15.0 (realistic) | |
PD [W] Calc. @RthJC max TJ=175°C, TC=25°C |
300.0 (ideal heatsink) |
BVDSS [V] | Package | RDS(ON) max [Ω] | VTH [V] | ID [A] | PD [W] | QG Total [nC] | QGS [nC] | QGD [nC] |
200 | Surface Mount WxL: 9.90 x 11.68mm2 # of Pins: 8 Thermalpad: Bottom |
0.0076 | 2.3, 4.3 | 160 | 359 | 176 | 65.3 | 34.8 |
200 | Surface Mount WxL: 9.90 x 11.68mm2 # of Pins: 8 Thermalpad: Bottom |
0.0082 | 2, 4 | 360 | 316 | 129 | 48 | 37 |