| Device Parameter | Value feedback* | |
| Manufacturer Name | Infineon | |
| Manufacturer Package | PG-TO247-3 (Through Hole, 3 Pins, Thermalpad: Bottom WxL: 15.94 x 20.95mm2) |
|
| Configuration | Single | |
| Channel | N-Type | |
| Material | Silicon | |
| BVDSS [V] | 150 | |
| RDS(ON) typ, max [Ω] | 0.0023, 0.0027 At VGS = 10V, TA = 25°C |
|
| ID max [A] | 316 | |
| PD max [W] | 556 | |
| QGS typ, max [nC] | 65, na | |
| QGD typ, max [nC] | 32, na | |
| QG Total typ, max [nC] | 160, 200 | |
| RthJA max [C/W] | 40 | |
| RthJC max [C/W] | 0.27 | |
| DiscoverEE Calculated Values | ||
| ID [A] Calc. @RthJA max TJ=175°C, TA=25°C |
23.6 (conservative) Approx. value as we assume RDS(on)max @ 175 °C = 2.5x RDS(on)max @ 25 °C |
|
| ID [A] Calc. @ System RthJA = °C/W, TJ=°C, TA=25°C | 47.1 (realistic) Approx. value as we assume RDS(on)max @ 175 °C = 2.5x RDS(on)max @ 25 °C
|
|
| ID [A] Calc. @RthJC max TJ=175°C, TC=25°C |
286.9 (ideal heatsink, Silicon limit) Approx. value as we assume RDS(on)max @ 175 °C = 2.5x RDS(on)max @ 25 °C |
|
| PD [W] Calc. @RthJA max TJ=175°C, TA=25°C |
3.8 (conservative) | |
| PD [W] Calc. @ System RthJA = 10 °C/W, TJ=175°C, TA=25°C | 15.0 (realistic) | |
| PD [W] Calc. @RthJC max TJ=175°C, TC=25°C |
555.6 (ideal heatsink) | |
| BVDSS [V] | Package | RDS(ON) max [Ω] | VTH [V] | ID [A] | PD [W] | QG Total [nC] | QGS [nC] | QGD [nC] |
| 150 | Through Hole WxL: 15.62 x 20.57mm2 # of Pins: 3 Thermalpad: Bottom |
0.0028 | 2, 4 | 366 | 833 | 138 | 44 | 20 |
| 150 | Through Hole WxL: 15.94 x 21.07mm2 # of Pins: 3 Thermalpad: Bottom |
0.003 | 2.5, 4.5 | 400 | 1250 | 365 | 103 | 87 |
| 150 | Through Hole WxL: 15.94 x 21.07mm2 # of Pins: 3 Thermalpad: Bottom |
0.0031 | 2.5, 4.5 | 400 | 1500 | 430 | 100 | 100 |
| 150 | Through Hole WxL: 15.80 x 20.95mm2 # of Pins: 3 Thermalpad: Bottom |
0.0032 | 2, 4 | 330 | 637 | 157.8 | 59.8 | 33.4 |