| Device Parameter | Value feedback* | |
| Manufacturer Name | Infineon | |
| Manufacturer Package | MG-WDSON-11 (Surface Mount, 9 Pins, Thermalpad: Dual Cool WxL: 6.98 x 9.10mm2) |
|
| Configuration | Single | |
| Channel | N-Type | |
| Material | Silicon | |
| BVDSS [V] | 60 | |
| RDS(ON) typ, max [Ω] | 0.0011, 0.0015 At VGS = 10V, TA = 25°C |
|
| ID max [A] | 375 | |
| PD max [W] | 125 | |
| QGS typ, max [nC] | 36, na | |
| QGD typ, max [nC] | 71, 110 | |
| QG Total typ, max [nC] | 200, 300 | |
| RthJA max [C/W] | 45 | |
| RthJC max [C/W] | 1.2 | |
| DiscoverEE Calculated Values | ||
| ID [A] Calc. @RthJA max TJ=175°C, TA=25°C |
29.8 (conservative) Approx. value as we assume RDS(on)max @ 175 °C = 2.5x RDS(on)max @ 25 °C |
|
| ID [A] Calc. @ System RthJA = °C/W, TJ=°C, TA=25°C | 63.2 (realistic) Approx. value as we assume RDS(on)max @ 175 °C = 2.5x RDS(on)max @ 25 °C
|
|
| ID [A] Calc. @RthJC max TJ=175°C, TC=25°C |
182.6 (ideal heatsink, Silicon limit) Approx. value as we assume RDS(on)max @ 175 °C = 2.5x RDS(on)max @ 25 °C |
|
| PD [W] Calc. @RthJA max TJ=175°C, TA=25°C |
3.3 (conservative) | |
| PD [W] Calc. @ System RthJA = 10 °C/W, TJ=175°C, TA=25°C | 15.0 (realistic) | |
| PD [W] Calc. @RthJC max TJ=175°C, TC=25°C |
125.0 (ideal heatsink) | |
| BVDSS [V] | Package | RDS(ON) max [Ω] | VTH [V] | ID [A] | PD [W] | QG Total [nC] | QGS [nC] | QGD [nC] |
| 55 | Surface Mount WxL: 7.95 x 8.00mm2 # of Pins: 4 Thermalpad: Bottom |
0.00103 | 1.2, 2.2 | 330 | 375 | 395 | 53 | 62 |
| 60 | Surface Mount WxL: 7.00 x 8.00mm2 # of Pins: 5 Thermalpad: Bottom |
0.0011 | 2.1, 3.3 | 399 | 313 | 154 | 36 | 20 |
| 60 | Surface Mount WxL: 8.00 x 8.00mm2 # of Pins: 8 Thermalpad: Dual Cool |
0.0011 | 2, 4 | 292 | 156 | 238 | 71 | 19 |
| 60 | Surface Mount WxL: 7.00 x 8.00mm2 # of Pins: 5 Thermalpad: Bottom |
0.0015 | 2.1, 3.3 | 242 | 167 | 89 | 23 | 12.9 |