| Device Parameter | Value feedback* | |
| Manufacturer Name | Toshiba | |
| Manufacturer Package | TO-220SIS (Through Hole, 3 Pins, Thermalpad: None WxL: 10.00 x 15.00mm2) |
|
| Configuration | Single | |
| Channel | P-Type | |
| Material | Silicon | |
| BVDSS [V] | -100 | |
| RDS(ON) typ, max [Ω] | 0.063, 0.09 At VGS = -10V, TA = 25°C |
|
| ID max [A] | -20 | |
| PD max [W] | 35 | |
| QGS typ, max [nC] | na, na | |
| QGD typ, max [nC] | 32, na | |
| QG Total typ, max [nC] | 120, na | |
| RthJA max [C/W] | 62.5 | |
| RthJC max [C/W] | 3.57 | |
| DiscoverEE Calculated Values | ||
| ID [A] Calc. @RthJA max TJ=150°C, TA=25°C |
3.3 (conservative) Approx. value as we assume RDS(on)max @ 150 °C = 2x RDS(on)max @ 25 °C |
|
| ID [A] Calc. @ System RthJA = °C/W, TJ=°C, TA=25°C | 8.3 (realistic) Approx. value as we assume RDS(on)max @ 150 °C = 2x RDS(on)max @ 25 °C
|
|
| ID [A] Calc. @RthJC max TJ=150°C, TC=25°C |
13.9 (ideal heatsink, Silicon limit) Approx. value as we assume RDS(on)max @ 150 °C = 2x RDS(on)max @ 25 °C |
|
| PD [W] Calc. @RthJA max TJ=150°C, TA=25°C |
2.0 (conservative) | |
| PD [W] Calc. @ System RthJA = 10 °C/W, TJ=150°C, TA=25°C | 12.5 (realistic) | |
| PD [W] Calc. @RthJC max TJ=150°C, TC=25°C |
35.0 (ideal heatsink) | |
| BVDSS [V] | Package | RDS(ON) max [Ω] | VTH [V] | ID [A] | PD [W] | QG Total [nC] | QGS [nC] | QGD [nC] |
| -100 | Through Hole WxL: 10.16 x 15.37mm2 # of Pins: 3 Thermalpad: Bottom |
0.06 | -2, -4 | -29 | 200 | 180 | 25 | 97 |
| -100 | Through Hole WxL: 10.00 x 15.40mm2 # of Pins: 3 Thermalpad: Bottom |
0.09 | -2.5, -4.5 | -26 | 150 | 52 | 18 | 16 |
| -100 | Through Hole WxL: 10.16 x 15.00mm2 # of Pins: 3 Thermalpad: Bottom |
0.095 | -1.2, -2.5 | -16 | 54 | 44 | 9 | 6 |
| -100 | Through Hole WxL: 10.08 x 15.60mm2 # of Pins: 3 Thermalpad: Bottom |
0.1 | -1, -3 | -12 | 70 | 61 | 14 | 29 |
| -100 | Through Hole WxL: 10.00 x 15.60mm2 # of Pins: 3 Thermalpad: Bottom |
0.1 | -1, -3 | -12 | 70 | 61 | 14 | 29 |
| -100 | Through Hole WxL: 10.16 x 15.00mm2 # of Pins: 3 Thermalpad: Bottom |
0.1 | -1, -3.5 | -15 | 89 | 50 | 7.5 | 16.5 |
| -100 | Through Hole WxL: 10.00 x 15.60mm2 # of Pins: 3 Thermalpad: Bottom |
0.11 | -1, -2.5 | -15 | 88 | 70 | 12 | 15 |
| -100 | Through Hole WxL: 10.16 x 15.37mm2 # of Pins: 3 Thermalpad: Bottom |
0.117 | -2, -4 | -16 | 140 | 97 | 15 | 51 |
| -100 | Through Hole WxL: 10.00 x 15.40mm2 # of Pins: 3 Thermalpad: Bottom |
0.12 | -2.5, -4.5 | -18 | 83 | 39 | 17 | 9 |
| -100 | Through Hole WxL: 10.16 x 15.87mm2 # of Pins: 3 Thermalpad: None |
0.12 | -1.5, -4 | -15 | 38 | 58 | 13.8 | 10.5 |