| Device Parameter | Value feedback* | |
| Manufacturer Name | EPC | |
| Manufacturer Package | LGA 3.5 x 1.95 (Die, 8 Pins, Thermalpad: None WxL: 1.95 x 3.50mm2) |
|
| Configuration | Single | |
| Channel | N-Type | |
| Material | Gallium Nitride (GaN) | |
| BVDSS [V] | 100 | |
| RDS(ON) typ, max [Ω] | 0.0024, 0.0032 At VGS = 5V, TA = 25°C |
|
| ID max [A] | 60 | |
| PD max [W] | na | |
| QGS typ, max [nC] | 4.4, na | |
| QGD typ, max [nC] | 1.4, na | |
| QG Total typ, max [nC] | 12.5, 17.8 | |
| RthJA max [C/W] | 53 | |
| RthJC max [C/W] | 0.5 | |
| DiscoverEE Calculated Values | ||
| ID [A] Calc. @RthJA max TJ=150°C, TA=25°C |
19.2 (conservative) Approx. value as we assume RDS(on)max @ 150 °C = 2x RDS(on)max @ 25 °C |
|
| ID [A] Calc. @ System RthJA = °C/W, TJ=°C, TA=25°C | 44.2 (realistic) Approx. value as we assume RDS(on)max @ 150 °C = 2x RDS(on)max @ 25 °C
|
|
| ID [A] Calc. @RthJC max TJ=150°C, TC=25°C |
197.6 (ideal heatsink, Gallium Nitride (GaN) limit) Approx. value as we assume RDS(on)max @ 150 °C = 2x RDS(on)max @ 25 °C |
|
| PD [W] Calc. @RthJA max TJ=150°C, TA=25°C |
2.4 (conservative) | |
| PD [W] Calc. @ System RthJA = 10 °C/W, TJ=150°C, TA=25°C | 12.5 (realistic) | |
| PD [W] Calc. @RthJC max TJ=150°C, TC=25°C |
250.0 (ideal heatsink) | |
| BVDSS [V] | Package | RDS(ON) max [Ω] | VTH [V] | ID [A] | PD [W] | QG Total [nC] | QGS [nC] | QGD [nC] |
| 100 | DIE WxL: 1.95 x 3.50mm2 # of Pins: 8 Thermalpad: None |
0.0032 | 0.8, 2.5 | 60 | 13.6 | 3.2 | 1.5 | |
| 100 | DIE WxL: 1.95 x 3.50mm2 # of Pins: 28 Thermalpad: None |
0.0038 | 0.8, 2.5 | 48 | 14.8 | 4.1 | 1.5 |