| Device Parameter | Value feedback* | |
| Manufacturer Name | Vishay | |
| Manufacturer Package | HVMDIP (Through Hole, 3 Pins, Thermalpad: None WxL: 4.90 x 9.21mm2) |
|
| Configuration | Single | |
| Channel | P-Type | |
| Material | Silicon | |
| BVDSS [V] | -100 | |
| RDS(ON) typ, max [Ω] | na, 1.2 At VGS = -10V, TA = 25°C |
|
| ID max [A] | -0.49 | |
| PD max [W] | 1.3 | |
| QGS typ, max [nC] | na, 2.2 | |
| QGD typ, max [nC] | na, 4.1 | |
| QG Total typ, max [nC] | na, 8.7 | |
| RthJA max [C/W] | 120 | |
| RthJC max [C/W] | na | |
| DiscoverEE Calculated Values | ||
| ID [A] Calc. @RthJA max TJ=175°C, TA=25°C |
0.6 (conservative) Approx. value as we assume RDS(on)max @ 175 °C = 2.5x RDS(on)max @ 25 °C |
|
| ID [A] Calc. @ System RthJA = °C/W, TJ=°C, TA=25°C | 2.2 (realistic) Approx. value as we assume RDS(on)max @ 175 °C = 2.5x RDS(on)max @ 25 °C
|
|
| ID [A] Calc. @RthJC max TJ=175°C, TC=25°C |
na |
|
| PD [W] Calc. @RthJA max TJ=175°C, TA=25°C |
1.3 (conservative) | |
| PD [W] Calc. @ System RthJA = 10 °C/W, TJ=175°C, TA=25°C | 15.0 (realistic) | |
| PD [W] Calc. @RthJC max TJ=175°C, TC=25°C |
na | |
| BVDSS [V] | Package | RDS(ON) max [Ω] | VTH [V] | ID [A] | PD [W] | QG Total [nC] | QGS [nC] | QGD [nC] |
| -100 | Through Hole WxL: 4.90 x 9.21mm2 # of Pins: 3 Thermalpad: None |
1.2 | -2, -4 | -0.49 | 1.3 | 8.7 | 2.2 | 4.1 |
| -100 | Through Hole WxL: 4.90 x 9.21mm2 # of Pins: 3 Thermalpad: None |
1.2 | -2, -4 | -0.49 | 1.3 | 8.7 | 2.2 | 4.1 |
| -100 | Through Hole WxL: 6.55 x 7.18mm2 # of Pins: 3 Thermalpad: Bottom |
1.2 | -2, -4 | -2 | 25 | 8.7 | 2.2 | 4.1 |
| -100 | Through Hole WxL: 6.55 x 7.18mm2 # of Pins: 3 Thermalpad: Bottom |
1.2 | -2, -4 | -2 | 25 | 8.7 | 2.2 | 4.1 |
Datasheet