| Device Parameter | Value feedback* | |
| Manufacturer Name | Vishay | |
| Manufacturer Package | TO-247AC (Through Hole, 3 Pins, Thermalpad: Bottom WxL: 15.60 x 20.30mm2) |
|
| Configuration | Single | |
| Channel | N-Type | |
| Material | Silicon | |
| BVDSS [V] | 250 | |
| RDS(ON) typ, max [Ω] | na, 0.14 At VGS = 10V, TA = 25°C |
|
| ID max [A] | 23 | |
| PD max [W] | 190 | |
| QGS typ, max [nC] | na, 24 | |
| QGD typ, max [nC] | na, 71 | |
| QG Total typ, max [nC] | na, 140 | |
| RthJA max [C/W] | 40 | |
| RthJC max [C/W] | 0.65 | |
| DiscoverEE Calculated Values | ||
| ID [A] Calc. @RthJA max TJ=150°C, TA=25°C |
3.3 (conservative) Approx. value as we assume RDS(on)max @ 150 °C = 2x RDS(on)max @ 25 °C |
|
| ID [A] Calc. @ System RthJA = °C/W, TJ=°C, TA=25°C | 6.7 (realistic) Approx. value as we assume RDS(on)max @ 150 °C = 2x RDS(on)max @ 25 °C
|
|
| ID [A] Calc. @RthJC max TJ=150°C, TC=25°C |
26.2 (ideal heatsink, Silicon limit) Approx. value as we assume RDS(on)max @ 150 °C = 2x RDS(on)max @ 25 °C |
|
| PD [W] Calc. @RthJA max TJ=150°C, TA=25°C |
3.1 (conservative) | |
| PD [W] Calc. @ System RthJA = 10 °C/W, TJ=150°C, TA=25°C | 12.5 (realistic) | |
| PD [W] Calc. @RthJC max TJ=150°C, TC=25°C |
192.3 (ideal heatsink) | |
| BVDSS [V] | Package | RDS(ON) max [Ω] | VTH [V] | ID [A] | PD [W] | QG Total [nC] | QGS [nC] | QGD [nC] |
| 250 | Through Hole WxL: 15.60 x 19.90mm2 # of Pins: 3 Thermalpad: Bottom |
0.094 | 3, 5 | 33 | 245 | 46.8 | 10.8 | 16 |
| 250 | Through Hole WxL: 15.60 x 19.90mm2 # of Pins: 3 Thermalpad: Bottom |
0.095 | 2, 3 | 30 | 125 | |||
| 250 | Through Hole WxL: 15.60 x 19.90mm2 # of Pins: 3 Thermalpad: Bottom |
0.11 | 3, 5 | 27 | 210 | 65 | 12.5 | 26 |
| 250 | Through Hole WxL: 15.58 x 20.27mm2 # of Pins: 3 Thermalpad: Bottom |
0.14 | 2, 4 | 23 | 190 | 140 | 24 | 71 |
| 250 | Through Hole WxL: 16.01 x 21.13mm2 # of Pins: 3 Thermalpad: Bottom |
0.14 | 2.5, 4.5 | 30 | 355 | 130 | 22 | 77 |