Anbonsemi AS2309 is a Silicon MOSFET rated at -60V, -1.7A, 0.18Ω Rdson(max) in SOT-23

Datasheet

Device Parameter	Value feedback*
Manufacturer Name	Anbonsemi
Manufacturer Package	SOT-23 (Surface Mount, 3 Pins, Thermalpad: None WxL: 2.40 x 2.90mm²)
Configuration	Single
Channel	P-Type
Material	Silicon
BVDSS [V]	-60
RDS(ON) typ, max [Ω]	na, 0.18 At VGS = -10V, TA = 25°C
ID max [A]	-1.7
PD max [W]	1
QGS typ, max [nC]	1.4, na
QGD typ, max [nC]	1.62, na
QG Total typ, max [nC]	4.6, na
RthJA max [C/W]	na
RthJC max [C/W]	na
DiscoverEE Calculated Values
ID [A] Calc. @RthJA max TJ=150°C, TA=25°C	na
ID [A] Calc. @ System RthJA = °C/W, TJ=°C, TA=25°C	5.9 (realistic) Approx. value as we assume RDS(on)max @ 150 °C = 2x RDS(on)max @ 25 °C
ID [A] Calc. @RthJC max TJ=150°C, TC=25°C	na
PD [W] Calc. @RthJA max TJ=150°C, TA=25°C	na
PD [W] Calc. @ System RthJA = 10 °C/W, TJ=150°C, TA=25°C	na
PD [W] Calc. @RthJC max TJ=150°C, TC=25°C	na

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BV_DSS [V]	Package	R_DS(ON) max [Ω]	V_TH [V]	I_D [A]	P_D [W]	Q_{G Total} [nC]	Q_GS [nC]	Q_GD [nC]
-60	Surface Mount WxL: 2.40 x 2.90mm² # of Pins: 3 Thermalpad: None	0.12	-1, -3	-4	1.5	25	3	7
-60	Surface Mount WxL: 2.37 x 2.92mm² # of Pins: 3 Thermalpad: None	0.125	-1, -2	-1.3	1	16.5	1.5	2.5
-60	Surface Mount WxL: 2.37 x 2.92mm² # of Pins: 3 Thermalpad: None	0.15	-1, -3	-1.2	0.83	9.5	1.52	1.76
-60	Surface Mount WxL: 2.45 x 2.90mm² # of Pins: 3 Thermalpad: None	0.15	-1, -2.5	-2.3	1.25	12.3	1.6	2.4
-60	Surface Mount WxL: 2.37 x 2.92mm² # of Pins: 3 Thermalpad: None	0.16	-1, -2.5	-1	1.5	12	2.5	3.9
-60	Surface Mount WxL: 2.40 x 2.90mm² # of Pins: 3 Thermalpad: None	0.19	-1.2, -2.5	-1.6	1.5	11.3	2.7	1.6
-60	Surface Mount WxL: 2.40 x 2.92mm² # of Pins: 3 Thermalpad: None	0.19	-1, -2.5	-1.5	1.25	8.3	1.8	1.6
-60	Surface Mount WxL: 2.40 x 2.90mm² # of Pins: 3 Thermalpad: None	0.23	-1, -3	0	0.5	13.8	1.5	1.3

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