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Infineon IRFP4868 is a Silicon MOSFET rated at 300V, 70A, 0.032Ω Rdson(max) in TO247

Datasheet


Device Parameter Value feedback*
Manufacturer Name Infineon
Manufacturer Package TO247
(Through Hole, 3 Pins,
Thermalpad: Bottom
WxL: 15.60 x 20.30mm2)
Configuration Single
Channel N-Type
Material Silicon
BVDSS [V] 300
RDS(ON) typ, max [Ω] 0.0255, 0.032
At VGS = 10V, TA = 25°C
ID max [A] 70
PD max [W] 517
QGS typ, max [nC] 60, na
QGD typ, max [nC] 57, na
QG Total typ, max [nC] 180, 270
RthJA max [C/W] 40
RthJC max [C/W] 0.29
DiscoverEE Calculated Values
ID [A] Calc. @RthJA max
TJ=175°C, TA=25°C 		6.8 (conservative)
Approx. value as we assume RDS(on)max @ 175 °C = 2.5x RDS(on)max @ 25 °C
ID [A] Calc. @ System RthJA = °C/W, TJ=°C, TA=25°C 13.7 (realistic)
Approx. value as we assume RDS(on)max @ 175 °C = 2.5x RDS(on)max @ 25 °C
ID [A] Calc. @RthJC max
TJ=175°C, TC=25°C 		80.4 (ideal heatsink, Silicon limit)
Approx. value as we assume RDS(on)max @ 175 °C = 2.5x RDS(on)max @ 25 °C
PD [W] Calc. @RthJA max
TJ=175°C, TA=25°C 		3.8 (conservative)
PD [W] Calc. @ System RthJA = 10 °C/W, TJ=175°C, TA=25°C 15.0 (realistic)
PD [W] Calc. @RthJC max
TJ=175°C, TC=25°C 		517.2 (ideal heatsink)

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WxL: 15.94 x 21.07mm2
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300 Through Hole
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300 Through Hole
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Thermalpad: None		 0.036 2, 4.5 75 417 360 60 180
300 Through Hole
WxL: 15.65 x 20.00mm2
# of Pins: 3
Thermalpad: Bottom		 0.036 3, 5 94 1040 102 33 37
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WxL: 16.01 x 21.13mm2
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Thermalpad: Bottom		 0.036 3, 5 94 890 190 65 53
300 Through Hole
WxL: 15.88 x 21.13mm2
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Thermalpad: Bottom		 0.036 3, 5 84 568 115 35 45
300 Through Hole
WxL: 15.88 x 21.13mm2
# of Pins: 3
Thermalpad: Bottom		 0.036 3, 5 84 568 115 35 45
300 Through Hole
WxL: 15.94 x 21.07mm2
# of Pins: 3
Thermalpad: None		 0.036 2.5, 5 60 250 224 50 110
300 Through Hole
WxL: 15.94 x 21.07mm2
# of Pins: 3
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Thermalpad: Bottom		 0.04 2.5, 5 88 600 180 44 90
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WxL: 16.01 x 21.13mm2
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300 Through Hole
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300 Through Hole
WxL: 15.80 x 20.95mm2
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300 Through Hole
WxL: 15.80 x 20.95mm2
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280 Through Hole
WxL: 15.60 x 19.90mm2
# of Pins: 3
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