ST STB12N60DM2AG is a Silicon MOSFET rated at 600V, 10A, 0.43Ω Rdson(max) in D2PAK

Datasheet

Device Parameter	Value feedback*
Manufacturer Name	ST
Manufacturer Package	D2PAK (Surface Mount, 3 Pins, Thermalpad: Bottom WxL: 10.20 x 15.43mm²)
Configuration	Single
Channel	N-Type
Material	Silicon
BVDSS [V]	600
RDS(ON) typ, max [Ω]	0.38, 0.43 At VGS = 10V, TA = 25°C
ID max [A]	10
PD max [W]	125
QGS typ, max [nC]	3.8, na
QGD typ, max [nC]	6.2, na
QG Total typ, max [nC]	14.5, na
RthJA max [C/W]	na
RthJC max [C/W]	1
DiscoverEE Calculated Values
ID [A] Calc. @RthJA max TJ=150°C, TA=25°C	na
ID [A] Calc. @ System RthJA = °C/W, TJ=°C, TA=25°C	3.8 (realistic) Approx. value as we assume RDS(on)max @ 150 °C = 2x RDS(on)max @ 25 °C
ID [A] Calc. @RthJC max TJ=150°C, TC=25°C	12.1 (ideal heatsink, Silicon limit) Approx. value as we assume RDS(on)max @ 150 °C = 2x RDS(on)max @ 25 °C
PD [W] Calc. @RthJA max TJ=150°C, TA=25°C	na
PD [W] Calc. @ System RthJA = 10 °C/W, TJ=150°C, TA=25°C	na
PD [W] Calc. @RthJC max TJ=150°C, TC=25°C	125.0 (ideal heatsink)

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BV_DSS [V]	Package	R_DS(ON) max [Ω]	V_TH [V]	I_D [A]	P_D [W]	Q_{G Total} [nC]	Q_GS [nC]	Q_GD [nC]
650	Surface Mount WxL: 10.07 x 14.99mm² # of Pins: 3 Thermalpad: Bottom	0.29	2.5, 4.5	12	31	22	7.8	7.2
600	Surface Mount WxL: 10.00 x 15.00mm² # of Pins: 3 Thermalpad: Bottom	0.299	2.5, 3.5	11	96	29	5	7.6
650	Surface Mount WxL: 10.00 x 15.00mm² # of Pins: 3 Thermalpad: Bottom	0.31	3.5, 4.5	11.4	104.2	41	7	22
650	Surface Mount WxL: 10.16 x 15.25mm² # of Pins: 3 Thermalpad: Bottom	0.33	3, 4	11	107	17	4.4	4.9
650	Surface Mount WxL: 10.16 x 15.25mm² # of Pins: 3 Thermalpad: Bottom	0.36	3, 4	11.5	101	19	6	6.5
650	Surface Mount WxL: 10.00 x 15.00mm² # of Pins: 3 Thermalpad: Bottom	0.36	2.5, 4	11	78	21	4.5	7
650	Surface Mount WxL: 10.00 x 15.20mm² # of Pins: 3 Thermalpad: Bottom	0.43	2, 4	7.5	62.5	18.4	4	6.5

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