Device Parameter | Value feedback* | |
Manufacturer Name | ST | |
Manufacturer Package | ISOTOP (Through Hole, 4 Pins, Thermalpad: None WxL: 25.33 x 38.00mm2) |
|
Configuration | Single | |
Channel | N-Type | |
Material | Silicon | |
BVDSS [V] | 600 | |
RDS(ON) typ, max [Ω] | 0.05, 0.055 At VGS = 10V, TA = 25°C |
|
ID max [A] | 70 | |
PD max [W] | 600 | |
QGS typ, max [nC] | 44.5, na | |
QGD typ, max [nC] | 95, na | |
QG Total typ, max [nC] | 178, 266 | |
RthJA max [C/W] | 30 | |
RthJC max [C/W] | 0.2 | |
DiscoverEE Calculated Values | ||
ID [A] Calc. @RthJA max TJ=150°C, TA=25°C |
6.2 (conservative) Approx. value as we assume RDS(on)max @ 150 °C = 2x RDS(on)max @ 25 °C |
|
ID [A] Calc. @ System RthJA = °C/W, TJ=°C, TA=25°C | 10.7 (realistic) Approx. value as we assume RDS(on)max @ 150 °C = 2x RDS(on)max @ 25 °C
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ID [A] Calc. @RthJC max TJ=150°C, TC=25°C |
75.4 (ideal heatsink, Silicon limit) Approx. value as we assume RDS(on)max @ 150 °C = 2x RDS(on)max @ 25 °C |
|
PD [W] Calc. @RthJA max TJ=150°C, TA=25°C |
4.2 (conservative) | |
PD [W] Calc. @ System RthJA = 10 °C/W, TJ=150°C, TA=25°C | 12.5 (realistic) | |
PD [W] Calc. @RthJC max TJ=150°C, TC=25°C |
625.0 (ideal heatsink) |
BVDSS [V] | Package | RDS(ON) max [Ω] | VTH [V] | ID [A] | PD [W] | QG Total [nC] | QGS [nC] | QGD [nC] |
600 | Through Hole WxL: 25.30 x 31.60mm2 # of Pins: 4 Thermalpad: None |
0.055 | 2.5, 5 | 84 | 961 | 598 | 128 | 251 |
600 | Through Hole WxL: 25.30 x 31.60mm2 # of Pins: 4 Thermalpad: None |
0.055 | 3, 5 | 84 | 960 | 600 | 130 | 250 |