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Littelfuse IXFH40N30 is a Silicon MOSFET rated at 300V, 40A, 0.085Ω Rdson(max) in TO-247



Device Parameter Value feedback*
Manufacturer Name Littelfuse
Manufacturer Package TO-247
(Through Hole, 3 Pins,
Thermalpad: Bottom
WxL: 15.86 x 21.13mm2)
Configuration Single
Channel N-Type
Material Silicon
BVDSS [V] 300
RDS(ON) typ, max [Ω] na, 0.085
At VGS = 10V, TA = 25°C
ID max [A] 40
PD max [W] 300
QGS typ, max [nC] 28, 50
QGD typ, max [nC] 78, 105
QG Total typ, max [nC] 177, 200
RthJA max [C/W] na
RthJC max [C/W] 0.42
DiscoverEE Calculated Values
ID [A] Calc. @RthJA max
TJ=150°C, TA=25°C
na
ID [A] Calc. @ System RthJA = °C/W, TJ=°C, TA=25°C 8.6 (realistic)
Approx. value as we assume RDS(on)max @ 150 °C = 2x RDS(on)max @ 25 °C
ID [A] Calc. @RthJC max
TJ=150°C, TC=25°C
41.8 (ideal heatsink, Silicon limit)
Approx. value as we assume RDS(on)max @ 150 °C = 2x RDS(on)max @ 25 °C
PD [W] Calc. @RthJA max
TJ=150°C, TA=25°C
na
PD [W] Calc. @ System RthJA = 10 °C/W, TJ=150°C, TA=25°C na
PD [W] Calc. @RthJC max
TJ=150°C, TC=25°C
297.6 (ideal heatsink)

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BVDSS [V] Package RDS(ON) max [Ω] VTH [V] ID [A] PD [W] QG Total [nC] QGS [nC] QGD [nC]
300 Through Hole
WxL: 15.60 x 19.90mm2
# of Pins: 3
Thermalpad: Bottom
0.056 3, 5 59 500 100 22 40
300 Through Hole
WxL: 15.80 x 21.00mm2
# of Pins: 3
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0.056 2.9, 4.1 60 658 106 21 28
300 Through Hole
WxL: 16.01 x 21.13mm2
# of Pins: 3
Thermalpad: Bottom
0.06 2, 4 52 360 150 34 75
300 Through Hole
WxL: 15.88 x 21.13mm2
# of Pins: 3
Thermalpad: Bottom
0.061 3, 5 54 403 64 23 26
300 Through Hole
WxL: 15.88 x 21.13mm2
# of Pins: 3
Thermalpad: Bottom
0.061 3, 5 54 403 64 23 26
300 Through Hole
WxL: 15.60 x 23.00mm2
# of Pins: 3
Thermalpad: None
0.065 3, 4.5 -30 85
300 Through Hole
WxL: 15.60 x 19.90mm2
# of Pins: 3
Thermalpad: Bottom
0.069 3, 5 43.5 310 150 29 58
300 Through Hole
WxL: 15.60 x 19.90mm2
# of Pins: 3
Thermalpad: Bottom
0.069 2, 4 40 150 130 25 60
300 Through Hole
WxL: 15.60 x 19.90mm2
# of Pins: 3
Thermalpad: Bottom
0.069 3, 4 40 150 130 25 60
300 Through Hole
WxL: 15.58 x 20.21mm2
# of Pins: 3
Thermalpad: Bottom
0.069 3, 5 38 341 125 42 39
300 Through Hole
WxL: 15.88 x 21.13mm2
# of Pins: 3
Thermalpad: Bottom
0.07 2, 4 48 370 225 52 99
300 Through Hole
WxL: 15.88 x 21.13mm2
# of Pins: 3
Thermalpad: Bottom
0.07 2, 4 48 370 225 52 99
300 Through Hole
WxL: 16.01 x 21.13mm2
# of Pins: 3
Thermalpad: Bottom
0.072 2.5, 4.5 50 540 330 52 180
300 Through Hole
WxL: 15.65 x 20.00mm2
# of Pins: 3
Thermalpad: Bottom
0.073 2.5, 5 52 400 110 25 53
300 Through Hole
WxL: 16.01 x 21.13mm2
# of Pins: 3
Thermalpad: Bottom
0.073 2.5, 5 52 400 110 25 53
300 Through Hole
WxL: 15.60 x 20.00mm2
# of Pins: 3
Thermalpad: Bottom
0.075 2, 4 42 300 90 16 40
300 Through Hole
WxL: 15.88 x 21.13mm2
# of Pins: 3
Thermalpad: Bottom
0.075 3, 5 44 329 57 21 23
300 Through Hole
WxL: 15.88 x 21.13mm2
# of Pins: 3
Thermalpad: Bottom
0.075 3, 5 44 329 57 21 23
300 Through Hole
WxL: 16.01 x 21.13mm2
# of Pins: 3
Thermalpad: Bottom
0.08 3.5, 6.5 50 690 65 22 32
300 Through Hole
WxL: 16.01 x 21.13mm2
# of Pins: 3
Thermalpad: Bottom
0.08 3, 5 46 460 86 34 20
300 Through Hole
WxL: 16.01 x 21.13mm2
# of Pins: 3
Thermalpad: Bottom
0.085 2, 4 40 300 140 35 70
300 Through Hole
WxL: 15.60 x 19.90mm2
# of Pins: 3
Thermalpad: Bottom
0.085 3, 5 38 312 60 17 28
300 Through Hole
WxL: 15.80 x 21.00mm2
# of Pins: 3
Thermalpad: Bottom
0.085 2.9, 4.1 40 357 72 13 21
300 Through Hole
WxL: 16.01 x 21.13mm2
# of Pins: 3
Thermalpad: Bottom
0.085 2, 4 40 300 220 50 105
300 Through Hole
WxL: 15.88 x 21.13mm2
# of Pins: 3
Thermalpad: Bottom
0.085 2, 4 40 300 195 37 77
300 Through Hole
WxL: 15.50 x 19.90mm2
# of Pins: 3
Thermalpad: Bottom
0.085 2, 4 38.5 290 123 25 47
300 Through Hole
WxL: 15.60 x 19.90mm2
# of Pins: 3
Thermalpad: Bottom
0.093 3, 4.5 40 150 60 15 25
300 Through Hole
WxL: 16.01 x 21.13mm2
# of Pins: 3
Thermalpad: Bottom
0.1 2.5, 4.5 38 400 260 43 140
300 Through Hole
WxL: 15.65 x 20.00mm2
# of Pins: 3
Thermalpad: Bottom
0.11 3, 5.5 36 300 70 17 35
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