| Device Parameter | Value feedback* | |
| Manufacturer Name | Littelfuse | |
| Manufacturer Package | TO-247 (Through Hole, 3 Pins, Thermalpad: Bottom WxL: 15.86 x 21.13mm2) |
|
| Configuration | Single | |
| Channel | N-Type | |
| Material | Silicon | |
| BVDSS [V] | 800 | |
| RDS(ON) typ, max [Ω] | na, 0.145 At VGS = 10V, TA = 25°C |
|
| ID max [A] | 40 | |
| PD max [W] | 860 | |
| QGS typ, max [nC] | 23, na | |
| QGD typ, max [nC] | 55, na | |
| QG Total typ, max [nC] | 98, na | |
| RthJA max [C/W] | na | |
| RthJC max [C/W] | 0.145 | |
| DiscoverEE Calculated Values | ||
| ID [A] Calc. @RthJA max TJ=150°C, TA=25°C |
na |
|
| ID [A] Calc. @ System RthJA = °C/W, TJ=°C, TA=25°C | 6.6 (realistic) Approx. value as we assume RDS(on)max @ 150 °C = 2x RDS(on)max @ 25 °C
|
|
| ID [A] Calc. @RthJC max TJ=150°C, TC=25°C |
54.5 (ideal heatsink, Silicon limit) Approx. value as we assume RDS(on)max @ 150 °C = 2x RDS(on)max @ 25 °C |
|
| PD [W] Calc. @RthJA max TJ=150°C, TA=25°C |
na | |
| PD [W] Calc. @ System RthJA = 10 °C/W, TJ=150°C, TA=25°C | na | |
| PD [W] Calc. @RthJC max TJ=150°C, TC=25°C |
862.1 (ideal heatsink) | |
| BVDSS [V] | Package | RDS(ON) max [Ω] | VTH [V] | ID [A] | PD [W] | QG Total [nC] | QGS [nC] | QGD [nC] |
| 800 | Through Hole WxL: 16.01 x 21.13mm2 # of Pins: 3 Thermalpad: Bottom |
0.105 | 3.5, 5.5 | 50 | 890 | 152 | 28 | 88 |
| 750 | Through Hole WxL: 15.80 x 21.00mm2 # of Pins: 4 Thermalpad: Bottom |
0.117 | 3.5, 5.6 | 23 | 113 | 15 | 4.3 | 3.5 |
| 750 | Through Hole WxL: 15.80 x 21.00mm2 # of Pins: 4 Thermalpad: Bottom |
0.182 | 3.5, 5.6 | 16 | 86 | 13 | 2.8 | 3.3 |