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Littelfuse IXTH58N25L2 is a Silicon MOSFET rated at 250V, 58A, 0.064Ω Rdson(max) in TO-247

Datasheet


Device Parameter Value feedback*
Manufacturer Name Littelfuse
Manufacturer Package TO-247
(Through Hole, 3 Pins,
Thermalpad: Bottom
WxL: 15.86 x 21.13mm2)
Configuration Single
Channel N-Type
Material Silicon
BVDSS [V] 250
RDS(ON) typ, max [Ω] na, 0.064
At VGS = 10V, TA = 25°C
ID max [A] 58
PD max [W] 540
QGS typ, max [nC] 50, na
QGD typ, max [nC] 175, na
QG Total typ, max [nC] 330, na
RthJA max [C/W] na
RthJC max [C/W] 0.23
DiscoverEE Calculated Values
ID [A] Calc. @RthJA max
TJ=150°C, TA=25°C 		na
ID [A] Calc. @ System RthJA = °C/W, TJ=°C, TA=25°C 9.9 (realistic)
Approx. value as we assume RDS(on)max @ 150 °C = 2x RDS(on)max @ 25 °C
ID [A] Calc. @RthJC max
TJ=150°C, TC=25°C 		65.2 (ideal heatsink, Silicon limit)
Approx. value as we assume RDS(on)max @ 150 °C = 2x RDS(on)max @ 25 °C
PD [W] Calc. @RthJA max
TJ=150°C, TA=25°C 		na
PD [W] Calc. @ System RthJA = 10 °C/W, TJ=150°C, TA=25°C na
PD [W] Calc. @RthJC max
TJ=150°C, TC=25°C 		543.5 (ideal heatsink)

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Thermalpad: Bottom		 0.06 3, 5 50 400 78 19 22
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WxL: 16.01 x 21.13mm2
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Thermalpad: Bottom		 0.06 3, 5 50 400 78 19 22
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WxL: 15.50 x 20.00mm2
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Thermalpad: None		 0.06 1.5, 3.5 30 260 100 31
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WxL: 15.62 x 20.57mm2
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WxL: 15.60 x 19.90mm2
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250 Through Hole
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250 Through Hole
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250 Through Hole
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250 Through Hole
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250 Through Hole
WxL: 15.60 x 19.90mm2
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Thermalpad: Bottom		 0.069 3, 4 30 110 19 53
250 Through Hole
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250 Through Hole
WxL: 15.60 x 19.90mm2
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Thermalpad: Bottom		 0.069 3, 4 30 110 19 53
250 Through Hole
WxL: 15.60 x 19.90mm2
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Thermalpad: Bottom		 0.069 3, 4 30 110 19 53
250 Through Hole
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250 Through Hole
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250 Through Hole
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250 Through Hole
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