| Device Parameter | Value feedback* | |
| Manufacturer Name | Littelfuse | |
| Manufacturer Package | OVERMOLDED TO-220 (Through Hole, 3 Pins, Thermalpad: None WxL: 10.16 x 15.87mm2) |
|
| Configuration | Single | |
| Channel | N-Type | |
| Material | Silicon | |
| BVDSS [V] | 1000 | |
| RDS(ON) typ, max [Ω] | 15, 17 At VGS = 10V, TA = 25°C |
|
| ID max [A] | 0.7 | |
| PD max [W] | 25 | |
| QGS typ, max [nC] | 1.4, na | |
| QGD typ, max [nC] | 4.1, na | |
| QG Total typ, max [nC] | 7.8, na | |
| RthJA max [C/W] | na | |
| RthJC max [C/W] | 5 | |
| DiscoverEE Calculated Values | ||
| ID [A] Calc. @RthJA max TJ=150°C, TA=25°C |
na |
|
| ID [A] Calc. @ System RthJA = °C/W, TJ=°C, TA=25°C | 0.6 (realistic) Approx. value as we assume RDS(on)max @ 150 °C = 2x RDS(on)max @ 25 °C
|
|
| ID [A] Calc. @RthJC max TJ=150°C, TC=25°C |
0.9 (ideal heatsink, Silicon limit) Approx. value as we assume RDS(on)max @ 150 °C = 2x RDS(on)max @ 25 °C |
|
| PD [W] Calc. @RthJA max TJ=150°C, TA=25°C |
na | |
| PD [W] Calc. @ System RthJA = 10 °C/W, TJ=150°C, TA=25°C | na | |
| PD [W] Calc. @RthJC max TJ=150°C, TC=25°C |
25.0 (ideal heatsink) | |
| BVDSS [V] | Package | RDS(ON) max [Ω] | VTH [V] | ID [A] | PD [W] | QG Total [nC] | QGS [nC] | QGD [nC] |
| 1000 | Through Hole WxL: 10.00 x 15.40mm2 # of Pins: 3 Thermalpad: Bottom |
11.8 | 2.5, 4.5 | 1.4 | 63 | 17.8 | 2.8 | 9.9 |
| 1000 | Through Hole WxL: 10.00 x 15.40mm2 # of Pins: 3 Thermalpad: Bottom |
15 | 2.5, 4.5 | 1 | 50 | 15.5 | 4.1 | 8 |
| 1000 | Through Hole WxL: 10.16 x 15.87mm2 # of Pins: 3 Thermalpad: None |
17 | 2.5, 4.5 | 0.7 | 25 | 7.8 | 1.4 | 4.1 |
| 1000 | Through Hole WxL: 10.00 x 15.40mm2 # of Pins: 3 Thermalpad: Bottom |
17 | 2.5, 4.5 | 0.75 | 40 | 7.8 | 1.4 | 4.1 |
| 1000 | Through Hole WxL: 10.00 x 15.40mm2 # of Pins: 3 Thermalpad: Bottom |
20 | 2, 4 | 0.8 | 42 | 11.3 | 1.7 | 6.7 |
| 1000 | Through Hole WxL: 10.00 x 15.40mm2 # of Pins: 3 Thermalpad: Bottom |
21 | -2, -4 | 0.8 | 60 | 14.6 | 1.2 | 8.3 |