Toshiba SSM6K810R is a Silicon MOSFET rated at 100V, 3.5A, 0.069Ω Rdson(max) in TSOP6F

Datasheet

Device Parameter	Value feedback*
Manufacturer Name	Toshiba
Manufacturer Package	TSOP6F (Surface Mount, 8 Pins, Thermalpad: None WxL: 2.80 x 2.90mm²)
Configuration	Single
Channel	N-Type
Material	Silicon
BVDSS [V]	100
RDS(ON) typ, max [Ω]	0.065, 0.092 At VGS = 4.5V, TA = 25°C
ID max [A]	3.5
PD max [W]	3
QGS typ, max [nC]	1.1, na
QGD typ, max [nC]	1.5, na
QG Total typ, max [nC]	3.2, na
RthJA max [C/W]	na
RthJC max [C/W]	na
DiscoverEE Calculated Values
ID [A] Calc. @RthJA max TJ=175°C, TA=25°C	na
ID [A] Calc. @ System RthJA = °C/W, TJ=°C, TA=25°C	9.3 (realistic) Approx. value as we assume RDS(on)max @ 175 °C = 2.5x RDS(on)max @ 25 °C
ID [A] Calc. @RthJC max TJ=175°C, TC=25°C	na
PD [W] Calc. @RthJA max TJ=175°C, TA=25°C	na
PD [W] Calc. @ System RthJA = 10 °C/W, TJ=175°C, TA=25°C	na
PD [W] Calc. @RthJC max TJ=175°C, TC=25°C	na

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BV_DSS [V]	Package	R_DS(ON) max [Ω]	V_TH [V]	I_D [A]	P_D [W]	Q_{G Total} [nC]	Q_GS [nC]	Q_GD [nC]
100	Surface Mount WxL: 2.80 x 2.90mm² # of Pins: 3 Thermalpad: None	0.06	1, 2.5	-3.5	1	6.7	1	1.2
100	Surface Mount WxL: 2.80 x 2.90mm² # of Pins: 8 Thermalpad: None	0.066	1.7, 2.8	12.5	20.8	12	1.5	1.5
100	Surface Mount WxL: 2.40 x 2.90mm² # of Pins: 3 Thermalpad: None	0.068	1.5, 2.5	3.5	1.2	9	1.7	3
100	Surface Mount WxL: 2.80 x 2.90mm² # of Pins: 3 Thermalpad: None	0.08	1, 3	3.5	1.7	5	2	1
100	Surface Mount WxL: 2.40 x 2.90mm² # of Pins: 3 Thermalpad: None	0.08	1, 2.5	3.4	1.7	5	2	1
100	Surface Mount WxL: 2.70 x 2.90mm² # of Pins: 6 Thermalpad: None	0.085	1, 2.5	3.5	1.6	4	0.7	1
100	Surface Mount WxL: 2.37 x 2.92mm² # of Pins: 3 Thermalpad: None	0.085	1, 2.5	3.5	1.26	4	0.7	1
100	Surface Mount WxL: 2.40 x 2.90mm² # of Pins: 3 Thermalpad: None	0.089	1.3, 2.4	3	1.3	4.3	1	0.8

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