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Diodes ZXM61N03F is a Silicon MOSFET rated at 30V, 1.4A, 0.22Ω Rdson(max) in SOT23



Device Parameter Value feedback*
Manufacturer Name Diodes
Manufacturer Package SOT23
(Surface Mount, 3 Pins,
Thermalpad: None
WxL: 2.30 x 2.90mm2)
Configuration Single
Channel N-Type
Material Silicon
BVDSS [V] 30
RDS(ON) typ, max [Ω] na, 0.22
At VGS = 10V, TA = 25°C
ID max [A] 1.4
PD max [W] 0.81
QGS typ, max [nC] na, 0.4
QGD typ, max [nC] na, 0.63
QG Total typ, max [nC] na, 4.1
RthJA max [C/W] 200
RthJC max [C/W] na
DiscoverEE Calculated Values
ID [A] Calc. @RthJA max
TJ=150°C, TA=25°C
1.2 (conservative)
Approx. value as we assume RDS(on)max @ 150 °C = 2x RDS(on)max @ 25 °C
ID [A] Calc. @ System RthJA = °C/W, TJ=°C, TA=25°C 5.3 (realistic)
Approx. value as we assume RDS(on)max @ 150 °C = 2x RDS(on)max @ 25 °C
ID [A] Calc. @RthJC max
TJ=150°C, TC=25°C
na
PD [W] Calc. @RthJA max
TJ=150°C, TA=25°C
0.6 (conservative)
PD [W] Calc. @ System RthJA = 10 °C/W, TJ=150°C, TA=25°C 12.5 (realistic)
PD [W] Calc. @RthJC max
TJ=150°C, TC=25°C
na

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BVDSS [V] Package RDS(ON) max [Ω] VTH [V] ID [A] PD [W] QG Total [nC] QGS [nC] QGD [nC]
30 Surface Mount
WxL: 2.30 x 2.90mm2
# of Pins: 3
Thermalpad: None
0.15 0.7 2 0.81 2.93 0.57 0.92
30 Surface Mount
WxL: 2.40 x 2.90mm2
# of Pins: 3
Thermalpad: None
0.16 0.8, 3 1.4 0.5 1.8 0.5 0.5
30 Surface Mount
WxL: 2.40 x 2.90mm2
# of Pins: 3
Thermalpad: None
0.16 0.8, 2 1.1 0.5 3.5 1 2
30 Surface Mount
WxL: 2.40 x 2.92mm2
# of Pins: 3
Thermalpad: None
0.2 0.5, 1.3 1.6 1.25 1.5 0.3 0.3
30 Surface Mount
WxL: 2.37 x 2.92mm2
# of Pins: 3
Thermalpad: None
0.24 0.45, 1 1.44 0.86 0.9 0.2 0.3
30 Surface Mount
WxL: 2.37 x 2.92mm2
# of Pins: 3
Thermalpad: None
0.25 1 1.2 0.54 5 0.72 1.7
30 Surface Mount
WxL: 2.37 x 2.92mm2
# of Pins: 3
Thermalpad: None
0.25 1 1.2 0.54 5 0.72 1.7
30 Surface Mount
WxL: 2.37 x 2.92mm2
# of Pins: 3
Thermalpad: None
0.25 1 1.2 0.54 5 0.72 1.7
30 Surface Mount
WxL: 2.30 x 2.90mm2
# of Pins: 3
Thermalpad: None
0.27 0.75, 1.25 1 2.1 1.2 0.1 0.2
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