| Device Parameter | Value feedback* | |
| Manufacturer Name | Infineonspace | |
| Manufacturer Package | SMD-2 (Surface Mount, 3 Pins, Thermalpad: Bottom WxL: 13.34 x 17.53mm2) |
|
| Configuration | Single | |
| Channel | N-Type | |
| Material | Silicon | |
| BVDSS [V] | 500 | |
| RDS(ON) typ, max [Ω] | na, 0.32 At VGS = 12V, TA = 25°C |
|
| ID max [A] | 20 | |
| PD max [W] | 300 | |
| QGS typ, max [nC] | na, 50 | |
| QGD typ, max [nC] | na, 110 | |
| QG Total typ, max [nC] | na, 220 | |
| RthJA max [C/W] | na | |
| RthJC max [C/W] | 0.42 | |
| DiscoverEE Calculated Values | ||
| ID [A] Calc. @RthJA max TJ=150°C, TA=25°C |
na |
|
| ID [A] Calc. @ System RthJA = °C/W, TJ=°C, TA=25°C | 4.4 (realistic) Approx. value as we assume RDS(on)max @ 150 °C = 2x RDS(on)max @ 25 °C
|
|
| ID [A] Calc. @RthJC max TJ=150°C, TC=25°C |
21.6 (ideal heatsink, Silicon limit) Approx. value as we assume RDS(on)max @ 150 °C = 2x RDS(on)max @ 25 °C |
|
| PD [W] Calc. @RthJA max TJ=150°C, TA=25°C |
na | |
| PD [W] Calc. @ System RthJA = 10 °C/W, TJ=150°C, TA=25°C | na | |
| PD [W] Calc. @RthJC max TJ=150°C, TC=25°C |
297.6 (ideal heatsink) | |
| BVDSS [V] | Package | RDS(ON) max [Ω] | VTH [V] | ID [A] | PD [W] | QG Total [nC] | QGS [nC] | QGD [nC] |
| 500 | Surface Mount WxL: 10.50 x 21.15mm2 # of Pins: 3 Thermalpad: Bottom |
0.27 | 3, 5.5 | 22 | 350 | 50 | 16 | 18 |
| 500 | Surface Mount WxL: 13.34 x 17.53mm2 # of Pins: 3 Thermalpad: Bottom |
0.32 | 2.5, 4.5 | 20 | 300 | 220 | 50 | 110 |
| 500 | Surface Mount WxL: 13.46 x 18.03mm2 # of Pins: 3 Thermalpad: Bottom |
0.32 | 2.5, 4.5 | 20 | 300 | 220 | 50 | 110 |
| 500 | Surface Mount WxL: 13.46 x 18.03mm2 # of Pins: 3 Thermalpad: Bottom |
0.32 | 2.5, 4.5 | 20 | 300 | 220 | 50 | 110 |