| Device Parameter | Value feedback* | |
| Manufacturer Name | Microsemi | |
| Manufacturer Package | T-MAX (Through Hole, 3 Pins, Thermalpad: Bottom WxL: 15.88 x 21.13mm2) |
|
| Configuration | Single | |
| Channel | N-Type | |
| Material | Silicon | |
| BVDSS [V] | 1200 | |
| RDS(ON) typ, max [Ω] | na, 0.67 At VGS = 10V, TA = 25°C |
|
| ID max [A] | 18 | |
| PD max [W] | 565 | |
| QGS typ, max [nC] | 20, na | |
| QGD typ, max [nC] | 95, na | |
| QG Total typ, max [nC] | 150, na | |
| RthJA max [C/W] | 40 | |
| RthJC max [C/W] | 0.22 | |
| DiscoverEE Calculated Values | ||
| ID [A] Calc. @RthJA max TJ=150°C, TA=25°C |
1.5 (conservative) Approx. value as we assume RDS(on)max @ 150 °C = 2x RDS(on)max @ 25 °C |
|
| ID [A] Calc. @ System RthJA = °C/W, TJ=°C, TA=25°C | 3.1 (realistic) Approx. value as we assume RDS(on)max @ 150 °C = 2x RDS(on)max @ 25 °C
|
|
| ID [A] Calc. @RthJC max TJ=150°C, TC=25°C |
20.6 (ideal heatsink, Silicon limit) Approx. value as we assume RDS(on)max @ 150 °C = 2x RDS(on)max @ 25 °C |
|
| PD [W] Calc. @RthJA max TJ=150°C, TA=25°C |
3.1 (conservative) | |
| PD [W] Calc. @ System RthJA = 10 °C/W, TJ=150°C, TA=25°C | 12.5 (realistic) | |
| PD [W] Calc. @RthJC max TJ=150°C, TC=25°C |
568.2 (ideal heatsink) | |
| BVDSS [V] | Package | RDS(ON) max [Ω] | VTH [V] | ID [A] | PD [W] | QG Total [nC] | QGS [nC] | QGD [nC] |
| 1200 | Through Hole WxL: 15.88 x 21.13mm2 # of Pins: 3 Thermalpad: Bottom |
0.45 | 1.9 | 11 | 78 | 21 | 6 | 7 |
| 1200 | Through Hole WxL: 15.94 x 20.95mm2 # of Pins: 3 Thermalpad: Bottom |
0.455 | 1.8 | 10 | 63 | 10 | 3 | 3 |
| 1200 | Through Hole WxL: 15.80 x 21.00mm2 # of Pins: 4 Thermalpad: Bottom |
0.468 | 3.5, 5.7 | 4.7 | 60 | 5.3 | 1.5 | 1.2 |
| 1200 | Through Hole WxL: 15.94 x 20.95mm2 # of Pins: 3 Thermalpad: Bottom |
0.468 | 3.5, 5.7 | 4.7 | 60 | 5.3 | 1.5 | 1.2 |
| 1200 | Through Hole WxL: 15.94 x 21.07mm2 # of Pins: 3 Thermalpad: Bottom |
0.5 | 3.5, 6.5 | 26 | 960 | 255 | 87 | 98 |
| 1200 | Through Hole WxL: 15.88 x 21.13mm2 # of Pins: 3 Thermalpad: Bottom |
0.53 | 3, 5 | 29 | 1135 | 300 | 50 | 140 |
| 1200 | Through Hole WxL: 15.94 x 21.07mm2 # of Pins: 3 Thermalpad: None |
0.55 | 3.5, 6.5 | 15 | 320 | 225 | 87 | 98 |
| 1200 | Through Hole WxL: 15.88 x 21.13mm2 # of Pins: 3 Thermalpad: Bottom |
0.57 | 3, 5 | 22 | 690 | 185 | 24 | 120 |
| 1200 | Through Hole WxL: 15.88 x 21.13mm2 # of Pins: 3 Thermalpad: Bottom |
0.57 | 3, 5 | 22 | 690 | 290 | 29 | 180 |
| 1200 | Through Hole WxL: 15.94 x 21.07mm2 # of Pins: 3 Thermalpad: Bottom |
0.57 | 3.5, 6.5 | 20 | 780 | 193 | 74 | 85 |
| 1200 | Through Hole WxL: 15.88 x 21.13mm2 # of Pins: 3 Thermalpad: Bottom |
0.58 | 2.5, 5 | 27 | 1135 | 300 | 50 | 140 |
| 1200 | Through Hole WxL: 15.88 x 21.13mm2 # of Pins: 3 Thermalpad: Bottom |
0.63 | 3, 5 | 24 | 1040 | 260 | 42 | 120 |
| 1200 | Through Hole WxL: 15.94 x 21.07mm2 # of Pins: 3 Thermalpad: None |
0.63 | 3.5, 6.5 | 13 | 290 | 193 | 74 | 85 |
| 1200 | Through Hole WxL: 15.80 x 21.00mm2 # of Pins: 3 Thermalpad: Bottom |
0.675 | 1.8, 3.5 | 6.3 | 44 | 12 | 2.6 | 7.6 |
| 1200 | Through Hole WxL: 15.90 x 20.95mm2 # of Pins: 3 Thermalpad: Bottom |
0.69 | 1.8 | 12 | 110 | 21 | 0 | 0 |
| 1200 | Through Hole WxL: 15.60 x 20.00mm2 # of Pins: 3 Thermalpad: Bottom |
0.69 | 3, 5 | 12 | 250 | 44.2 | 7.3 | 30 |
| 1200 | Through Hole WxL: 15.60 x 20.00mm2 # of Pins: 3 Thermalpad: Bottom |
0.69 | 3, 5 | 12 | 250 | 44.2 | 7.3 | 30 |
| 1200 | Through Hole WxL: 15.60 x 20.00mm2 # of Pins: 3 Thermalpad: Bottom |
0.69 | 1.8 | 12 | 150 | 22 | 3 | 10 |
| 1200 | Through Hole WxL: 15.88 x 21.13mm2 # of Pins: 3 Thermalpad: Bottom |
0.7 | 2.5, 5 | 23 | 1040 | 260 | 42 | 120 |
| 1100 | Through Hole WxL: 15.80 x 21.00mm2 # of Pins: 3 Thermalpad: Bottom |
0.8 | 2.5, 4.5 | 12 | 151 | 60 | 14 | 22 |
| 1200 | Through Hole WxL: 15.80 x 21.00mm2 # of Pins: 3 Thermalpad: Bottom |
0.8 | 2.5, 4.5 | 12 | 151 | 60 | 14 | 22 |
| 1200 | Through Hole WxL: 15.94 x 21.07mm2 # of Pins: 3 Thermalpad: Bottom |
0.9 | 3, 6 | 17 | 700 | 155 | 41 | 60 |