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Microsemi APT50M75JLL is a Silicon MOSFET rated at 500V, 51A, 0.075Ω Rdson(max) in ISOTOP SOT-227 (J)



Device Parameter Value feedback*
Manufacturer Name Microsemi
Manufacturer Package ISOTOP SOT-227 (J)
(Through Hole, 4 Pins,
Thermalpad: None
WxL: 25.30 x 31.60mm2)
Configuration Single
Channel N-Type
Material Silicon
BVDSS [V] 500
RDS(ON) typ, max [Ω] na, 0.075
At VGS = 10V, TA = 25°C
ID max [A] 51
PD max [W] 460
QGS typ, max [nC] 33, na
QGD typ, max [nC] 65, na
QG Total typ, max [nC] 125, na
RthJA max [C/W] 40
RthJC max [C/W] 0.27
DiscoverEE Calculated Values
ID [A] Calc. @RthJA max
TJ=150°C, TA=25°C
4.6 (conservative)
Approx. value as we assume RDS(on)max @ 150 °C = 2x RDS(on)max @ 25 °C
ID [A] Calc. @ System RthJA = °C/W, TJ=°C, TA=25°C 9.1 (realistic)
Approx. value as we assume RDS(on)max @ 150 °C = 2x RDS(on)max @ 25 °C
ID [A] Calc. @RthJC max
TJ=150°C, TC=25°C
55.6 (ideal heatsink, Silicon limit)
Approx. value as we assume RDS(on)max @ 150 °C = 2x RDS(on)max @ 25 °C
PD [W] Calc. @RthJA max
TJ=150°C, TA=25°C
3.1 (conservative)
PD [W] Calc. @ System RthJA = 10 °C/W, TJ=150°C, TA=25°C 12.5 (realistic)
PD [W] Calc. @RthJC max
TJ=150°C, TC=25°C
463.0 (ideal heatsink)

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BVDSS [V] Package RDS(ON) max [Ω] VTH [V] ID [A] PD [W] QG Total [nC] QGS [nC] QGD [nC]
500 Through Hole
WxL: 25.30 x 31.60mm2
# of Pins: 4
Thermalpad: None
0.05 3, 5 71 595 200 50 105
500 Through Hole
WxL: 25.30 x 31.60mm2
# of Pins: 4
Thermalpad: None
0.05 3, 5 71 595 200 50 105
500 Through Hole
WxL: 25.30 x 31.60mm2
# of Pins: 4
Thermalpad: None
0.05 2, 4 77 700 1000 140 480
500 Through Hole
WxL: 25.30 x 31.60mm2
# of Pins: 4
Thermalpad: None
0.05 2, 4 77 700 1000 140 480
500 Through Hole
WxL: 25.30 x 31.60mm2
# of Pins: 4
Thermalpad: None
0.065 2.5, 5 58 540 340 75 155
500 Through Hole
WxL: 25.30 x 31.60mm2
# of Pins: 4
Thermalpad: None
0.065 3, 5 58 540 340 75 155
500 Through Hole
WxL: 25.30 x 31.60mm2
# of Pins: 4
Thermalpad: None
0.065 3, 5 58 520 141 40 70
500 Through Hole
WxL: 25.30 x 31.60mm2
# of Pins: 4
Thermalpad: None
0.065 3, 5 58 520 141 40 70
500 Through Hole
WxL: 25.30 x 31.60mm2
# of Pins: 4
Thermalpad: None
0.075 3, 5 51 460 125 33 65
500 Through Hole
WxL: 25.30 x 31.60mm2
# of Pins: 4
Thermalpad: None
0.075 2.5, 5 51 480 290 65 130
500 Through Hole
WxL: 25.30 x 31.60mm2
# of Pins: 4
Thermalpad: None
0.075 3, 5 51 480 290 65 130
500 Through Hole
WxL: 25.30 x 31.60mm2
# of Pins: 4
Thermalpad: None
0.085 2, 4 50 500 535 65 255
500 Through Hole
WxL: 25.30 x 31.60mm2
# of Pins: 4
Thermalpad: None
0.085 2, 4 50 500 535 65 255
500 Through Hole
WxL: 25.30 x 31.60mm2
# of Pins: 4
Thermalpad: None
0.09 2, 4 52 568
500 Through Hole
WxL: 25.30 x 31.60mm2
# of Pins: 4
Thermalpad: None
0.1 2.5, 5 38 355 220 50 100
500 Through Hole
WxL: 25.30 x 31.60mm2
# of Pins: 4
Thermalpad: None
0.1 3, 5 38 357 220 50 100
500 Through Hole
WxL: 25.30 x 31.60mm2
# of Pins: 4
Thermalpad: None
0.1 3, 5 41 378 95 24 50
500 Through Hole
WxL: 25.30 x 31.60mm2
# of Pins: 4
Thermalpad: None
0.1 2, 4 44 450 470 75 190
500 Through Hole
WxL: 25.30 x 31.60mm2
# of Pins: 4
Thermalpad: None
0.1 2, 4 44 450 470 75 190
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