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onsemi NVHL080N120SC1 is a Silicon Carbide (SiC) FET rated at 1200V, 44A, 0.11Ω Rdson(max) in TO-247-3LD



Device Parameter Value feedback*
Manufacturer Name onsemi
Manufacturer Package TO-247-3LD
(Through Hole, 3 Pins,
Thermalpad: Bottom
WxL: 15.62 x 20.57mm2)
Configuration Single
Channel N-Type
Material Silicon Carbide (SiC)
BVDSS [V] 1200
RDS(ON) typ, max [Ω] 0.08, 0.11
At VGS = 20V, TA = 25°C
ID max [A] 44
PD max [W] 348
QGS typ, max [nC] 11, na
QGD typ, max [nC] 12, na
QG Total typ, max [nC] 56, na
RthJA max [C/W] 40
RthJC max [C/W] 0.43
DiscoverEE Calculated Values
ID [A] Calc. @RthJA max
TJ=175°C, TA=25°C
3.7 (conservative)
Approx. value as we assume RDS(on)max @ 175 °C = 2.5x RDS(on)max @ 25 °C
ID [A] Calc. @ System RthJA = °C/W, TJ=°C, TA=25°C 7.4 (realistic)
Approx. value as we assume RDS(on)max @ 175 °C = 2.5x RDS(on)max @ 25 °C
ID [A] Calc. @RthJC max
TJ=175°C, TC=25°C
35.6 (ideal heatsink, Silicon Carbide (SiC) limit)
Approx. value as we assume RDS(on)max @ 175 °C = 2.5x RDS(on)max @ 25 °C
PD [W] Calc. @RthJA max
TJ=175°C, TA=25°C
3.8 (conservative)
PD [W] Calc. @ System RthJA = 10 °C/W, TJ=175°C, TA=25°C 15.0 (realistic)
PD [W] Calc. @RthJC max
TJ=175°C, TC=25°C
348.8 (ideal heatsink)

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BVDSS [V] Package RDS(ON) max [Ω] VTH [V] ID [A] PD [W] QG Total [nC] QGS [nC] QGD [nC]
1200 Through Hole
WxL: 15.90 x 21.10mm2
# of Pins: 3
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0.078 3.5, 5.7 36 150 31 9 7
1200 Through Hole
WxL: 15.80 x 21.00mm2
# of Pins: 3
Thermalpad: Bottom
0.08 44.5 250 129 29 64
1200 Through Hole
WxL: 15.80 x 21.00mm2
# of Pins: 3
Thermalpad: Bottom
0.08 1.5, 4.5 39 188 158 45 44
1200 Through Hole
WxL: 16.00 x 21.00mm2
# of Pins: 3
Thermalpad: Bottom
0.081 2.8, 4.8 26 115 64 14 17
1200 Through Hole
WxL: 15.92 x 20.95mm2
# of Pins: 4
Thermalpad: Bottom
0.085 1.8, 3.5 40.3 187.5 62.3 23.1 23.7
1200 Through Hole
WxL: 15.80 x 21.00mm2
# of Pins: 3
Thermalpad: Bottom
0.085 1.8, 3.5 40.3 187.5 62.3 23.1 23.7
1200 Through Hole
WxL: 15.60 x 22.54mm2
# of Pins: 4
Thermalpad: Bottom
0.087 2.04, 4.4 34 160 57 9.6 17
1200 Through Hole
WxL: 15.80 x 21.00mm2
# of Pins: 4
Thermalpad: Bottom
0.087 1.8, 4.2 30 236 41 11 17
1200 Through Hole
WxL: 15.62 x 20.57mm2
# of Pins: 3
Thermalpad: Bottom
0.087 2.04, 4.4 34 160 57 9.6 17
1200 Through Hole
WxL: 15.60 x 20.00mm2
# of Pins: 3
Thermalpad: Bottom
0.087 1.8, 4.2 30 236 41 11 17
1200 Through Hole
WxL: 15.80 x 21.00mm2
# of Pins: 4
Thermalpad: Bottom
0.09 1.8, 3.5 55 366 62 25 10
1200 Through Hole
WxL: 15.60 x 20.45mm2
# of Pins: 3
Thermalpad: Bottom
0.09 1.9, 3.5 38 231 62 25 10
1200 Through Hole
WxL: 15.80 x 20.95mm2
# of Pins: 3
Thermalpad: Bottom
0.09 1.8, 3.6 32 163 61 13 19
1200 Through Hole
WxL: 15.94 x 20.95mm2
# of Pins: 3
Thermalpad: Bottom
0.0975 1.7, 3.5 41 246 50.9 16.2 18.8
1200 Through Hole
WxL: 15.94 x 20.95mm2
# of Pins: 3
Thermalpad: Bottom
0.104 3.5, 5.7 33 150 28 9 7
1200 Through Hole
WxL: 15.60 x 20.00mm2
# of Pins: 3
Thermalpad: Bottom
0.105 1.9, 5 33 290 63 15 20
1200 Through Hole
WxL: 15.80 x 21.00mm2
# of Pins: 4
Thermalpad: Bottom
0.105 1.9, 5 33 290 63 15 20
1200 Through Hole
WxL: 15.90 x 20.95mm2
# of Pins: 3
Thermalpad: Bottom
0.105 1.9, 5 33 290 63 15 20
1200 Through Hole
WxL: 15.62 x 20.57mm2
# of Pins: 3
Thermalpad: Bottom
0.11 1.8, 4.3 31 178 56 11 12
1200 Through Hole
WxL: 15.62 x 20.57mm2
# of Pins: 3
Thermalpad: Bottom
0.11 1.8, 4.3 31 178 56 11 12
1200 Through Hole
WxL: 15.80 x 21.00mm2
# of Pins: 3
Thermalpad: Bottom
0.11 1.5, 4.5 33 224 131 57 23
1200 Through Hole
WxL: 16.00 x 21.00mm2
# of Pins: 3
Thermalpad: Bottom
0.117 2.8, 4.8 19 88 48 11 16
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