Renesas 2SK1317 is a Silicon MOSFET rated at 1500V, 2.5A, 12Ω Rdson(max) in TO-3P

Datasheet

Device Parameter	Value feedback*
Manufacturer Name	Renesas
Manufacturer Package	TO-3P (Through Hole, 3 Pins, Thermalpad: Bottom WxL: 15.60 x 19.90mm²)
Configuration	Single
Channel	N-Type
Material	Silicon
BVDSS [V]	1500
RDS(ON) typ, max [Ω]	9, 12 At VGS = 15V, TA = 25°C
ID max [A]	2.5
PD max [W]	100
QGS typ, max [nC]	na, na
QGD typ, max [nC]	na, na
QG Total typ, max [nC]	na, na
RthJA max [C/W]	na
RthJC max [C/W]	na
DiscoverEE Calculated Values
ID [A] Calc. @RthJA max TJ=150°C, TA=25°C	na
ID [A] Calc. @ System RthJA = °C/W, TJ=°C, TA=25°C	0.7 (realistic) Approx. value as we assume RDS(on)max @ 150 °C = 2x RDS(on)max @ 25 °C
ID [A] Calc. @RthJC max TJ=150°C, TC=25°C	na
PD [W] Calc. @RthJA max TJ=150°C, TA=25°C	na
PD [W] Calc. @ System RthJA = 10 °C/W, TJ=150°C, TA=25°C	na
PD [W] Calc. @RthJC max TJ=150°C, TC=25°C	na

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BV_DSS [V]	Package	R_DS(ON) max [Ω]	V_TH [V]	I_D [A]	P_D [W]	Q_{G Total} [nC]	Q_GS [nC]	Q_GD [nC]
1500	Through Hole WxL: 15.94 x 21.09mm² # of Pins: 3 Thermalpad: None	8	2.5, 5	2.3	110	38.6	6.5	19
1500	Through Hole WxL: 15.60 x 20.00mm² # of Pins: 3 Thermalpad: Bottom	9	3, 5	2.5	140	29.3	4.6	17
1500	Through Hole WxL: 16.01 x 21.13mm² # of Pins: 3 Thermalpad: Bottom	9.2	2.5, 5	2	170	28	4	16
1500	Through Hole WxL: 15.60 x 19.90mm² # of Pins: 3 Thermalpad: Bottom	10.5	2, 4	2.5	140	34	4.7	15
1500	Through Hole WxL: 15.60 x 19.90mm² # of Pins: 3 Thermalpad: Bottom	12	2, 4	2	50
1500	Through Hole WxL: 15.60 x 19.90mm² # of Pins: 3 Thermalpad: Bottom	13	2.5, 3.5	2	110	37.5	2.7	20
1500	Through Hole WxL: 16.01 x 21.13mm² # of Pins: 3 Thermalpad: Bottom	15	6, 8.5	2	290	72	15	30
1500	Through Hole WxL: 15.80 x 21.00mm² # of Pins: 3 Thermalpad: Bottom	15	3.5, 5	1.6	124	26	4.5	19.9

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