Loading...

Sanken MLD685D is a Silicon MOSFET rated at 60V, 85A, 0.0047Ω Rdson(max) in TO3P-3L



Device Parameter Value feedback*
Manufacturer Name Sanken
Manufacturer Package TO3P-3L
(Through Hole, 3 Pins,
Thermalpad: Bottom
WxL: 15.60 x 19.90mm2)
Configuration Single
Channel N-Type
Material Silicon
BVDSS [V] 60
RDS(ON) typ, max [Ω] 0.004, 0.0047
At VGS = 10V, TA = 25°C
ID max [A] 85
PD max [W] 150
QGS typ, max [nC] na, na
QGD typ, max [nC] na, na
QG Total typ, max [nC] na, na
RthJA max [C/W] na
RthJC max [C/W] na
DiscoverEE Calculated Values
ID [A] Calc. @RthJA max
TJ=150°C, TA=25°C
na
ID [A] Calc. @ System RthJA = °C/W, TJ=°C, TA=25°C 36.5 (realistic)
Approx. value as we assume RDS(on)max @ 150 °C = 2x RDS(on)max @ 25 °C
ID [A] Calc. @RthJC max
TJ=150°C, TC=25°C
na
PD [W] Calc. @RthJA max
TJ=150°C, TA=25°C
na
PD [W] Calc. @ System RthJA = 10 °C/W, TJ=150°C, TA=25°C na
PD [W] Calc. @RthJC max
TJ=150°C, TC=25°C
na

Similar Products

We found 22 products that are actively under promotion and similar to this product from 10 manufacturers.

BVDSS [V] Package RDS(ON) max [Ω] VTH [V] ID [A] PD [W] QG Total [nC] QGS [nC] QGD [nC]
60 Through Hole
WxL: 15.60 x 20.45mm2
# of Pins: 3
Thermalpad: Bottom
0.0031 2, 4 150 220 152 33 55
60 Through Hole
WxL: 15.60 x 20.45mm2
# of Pins: 3
Thermalpad: Bottom
0.0031 1.3, 2.1 150 220 184 28 40
60 Through Hole
WxL: 16.01 x 21.13mm2
# of Pins: 3
Thermalpad: Bottom
0.0031 2, 4 270 480 200 68 40
55 Through Hole
WxL: 16.01 x 21.13mm2
# of Pins: 3
Thermalpad: Bottom
0.0033 2, 4 260 480 140 52 32
60 Through Hole
WxL: 15.58 x 20.21mm2
# of Pins: 3
Thermalpad: Bottom
0.0033 2.1, 3.7 172 230 210 36 43
60 Through Hole
WxL: 15.94 x 21.07mm2
# of Pins: 3
Thermalpad: Bottom
0.0034 1, 2.5 180 166 139 30 27
60 Through Hole
WxL: 16.01 x 21.13mm2
# of Pins: 3
Thermalpad: Bottom
0.004 2, 4 220 440 136 44 30
60 Through Hole
WxL: 15.60 x 20.45mm2
# of Pins: 3
Thermalpad: Bottom
0.004 2, 4 120 155 51 12 7.3
60 Through Hole
WxL: 15.58 x 20.21mm2
# of Pins: 3
Thermalpad: Bottom
0.0042 2, 4 160 220 120 20 26
60 Through Hole
WxL: 15.60 x 19.90mm2
# of Pins: 3
Thermalpad: Bottom
0.0045 1, 2 85 100 85 11 25
60 Through Hole
WxL: 15.94 x 21.07mm2
# of Pins: 3
Thermalpad: None
0.005 2, 4 180 560 420 65 220
55 Through Hole
WxL: 16.01 x 21.13mm2
# of Pins: 3
Thermalpad: Bottom
0.005 2, 4 182 360 114 30 32
55 Through Hole
WxL: 15.65 x 20.00mm2
# of Pins: 3
Thermalpad: Bottom
0.005 2, 4 182 360 114 30 32
55 Through Hole
WxL: 15.58 x 20.21mm2
# of Pins: 3
Thermalpad: Bottom
0.0053 2, 4 160 310 180 30 53
60 Through Hole
WxL: 15.60 x 19.90mm2
# of Pins: 3
Thermalpad: Bottom
0.0055 1, 2.5 90 150 180 32 36
60 Through Hole
WxL: 15.60 x 19.90mm2
# of Pins: 3
Thermalpad: Bottom
0.0056 2, 4 170 375 290 50 100
60 Through Hole
WxL: 15.80 x 20.95mm2
# of Pins: 3
Thermalpad: Bottom
0.0058 2.4, 3.6 170 284 351 96 143
60 Through Hole
WxL: 15.60 x 19.90mm2
# of Pins: 3
Thermalpad: Bottom
0.0058 1.5, 2.5 75 150 170 28 46
60 Through Hole
WxL: 15.50 x 20.00mm2
# of Pins: 3
Thermalpad: None
0.006 3, 4 70 125 98 57 41
60 Through Hole
WxL: 15.60 x 19.90mm2
# of Pins: 3
Thermalpad: Bottom
0.006 1, 2 75 150
55 Through Hole
WxL: 15.60 x 20.00mm2
# of Pins: 3
Thermalpad: Bottom
0.006 2, 4 120 300 190 35 70
60 Through Hole
WxL: 15.60 x 19.90mm2
# of Pins: 3
Thermalpad: Bottom
0.006 2, 4 -70 130
Additional Resources